ADM2
- Known as:
- ADM2
- Catalog number:
- 001224A
- Product Quantity:
- 250ul
- Category:
- -
- Supplier:
- ABM
- Gene target:
- ADM2
Related genes to: ADM2
- Gene:
- ADM2 NIH gene
- Name:
- adrenomedullin 2
- Previous symbol:
- -
- Synonyms:
- AM2, FLJ21135
- Chromosome:
- 22q13.33
- Locus Type:
- gene with protein product
- Date approved:
- 2004-02-04
- Date modifiied:
- 2014-11-19
Related products to: ADM2
Related articles to: ADM2
- Congenital heart defects (CHDs) comprise the most common congenital malformation affecting nearly 1% of all newborns. In individuals with sex chromosome aneuploidy syndromes, however, the prevalence reaches up to 50% of all livebirths. One commonality to these syndromes is a marked reduction in sex hormones, particularly androgens. Androgen receptor (Ar) insufficiency represents a culprit in the pathophysiology of adult onset cardiovascular disease and arrhythmia, but there are no reports regarding Ar function during heart development. This is surprising as androgens along with its nuclear receptor exist already during early development, even before gonads develop and become functional. - Source: PubMed
Publication date: 2026/07/30
Duong Phu MaxGuerrero Samanidis AlessandraLaibacher SabrinaBurczyk MartinaAlkhars YaraJanovic AnaAl Madhoun AshrafSkerjanc Ilona SBurkhalter Martin DPhilipp Melanie - Because corrosive environments are created, agricultural equipment used in livestock farms and poultry houses that handle animal waste is vulnerable to corrosion. Therefore, the purpose of this work was to increase the corrosion resistance of AISI 1020 low-carbon steel by applying protective Ni@SiTiCNO nanocomposite coatings using the electrodeposition technique, where ‘@’ denotes the incorporation of nanoparticles into the matrix, not a core-shell structure. Fourier Transform Infrared Spectroscopy (FT-IR), Raman, Field Emission Scanning Electron Microscopy (FE-SEM, QUANTA EG) with an energy dispersive X-ray system (FE-SEM, EDS), and High-Resolution Transmission Electron Microscopy (HR-TEM) have all been used to study the structure and morphology of the SiTiCNO nanoparticle. Additionally, the surface area and optical characteristics were examined. During the deposition process, various SiTiCNO nanoparticle concentrations (0–2 g/L) and current densities (3–5 A/dm2) were employed. The surface morphology, corrosion resistance (in urea 3.5%), and abrasion behavior have all been thoroughly examined. According to the corrosion resistance results, uncoated steel had a high corrosion rate (0.556 mm/a), whereas Ni@SiTiCNO deposited at 5/Adm2 from the Watts electrolyte bath containing 2 g/L SiTiCNO nanoparticle had the lower corrosion rate (0.008 mm/a) means the highest corrosion resistance. - Source: PubMed
Publication date: 2026/04/17
Nasr Gamal E MRefai Mohamed AElaziz Aliaa G AbdGomaa Mona HEl-Sheikh Said MAhmed Yasser M ZHamid Z Abdel - Collagen membranes are widely used biomaterials in periodontal and implant dentistry and can be combined with hyaluronic acid (HA). Although collagen membranes are expected to exhibit bioactive properties and support fibroblast infiltration, their specific impact on fibroblast behavior remains unclear. - Source: PubMed
Publication date: 2026/01/23
Panahipour LaylaHuang XiaoyuGruber Reinhard - The Cu pillar bump, an electrode formed on a silicon chip, connects the devices inside a high bandwidth memory (HBM) package and is the most important interconnection affecting the electrical, thermal, and mechanical properties of advanced semiconductor package. Recently, the number of input/output (I/O) in HBM packages has been increasing and the fine pitch of Cu pillar is also becoming significantly smaller. Therefore, the bonding strength between electrodes is deteriorating due to the increase in interconnection density and fine pitch, which threatens the reliability of semiconductor packages. Also, the bonding strengths between Cu pillars, electrodes inside HBM package are greatly affected by the plating process, package temperature, interconnection technology, package process, as well as thermal expansion coefficient of materials, crystal structure and orientation of the material, and electrochemical reaction while using electronic packages. After Ti is sputtered as a bonding layer and Cu is sputtered as a seed layer onto the Si chip electrode, and finally, Cu pillar bumps (25 μm in diameter, 55 μm in pitch) are formed through electroplating. When the Cu seed layer is removed by etching, leaving only the electrode portion of chip, the Cu pillar bump is completed, but an undercut occurs at the interface of Cu pillar and Cu seed layer during the etching process of Cu seed layer. Electroplating process of Cu pillar bump was performed at conditions of 3.0, 8.0 and 13.0 A/dm (ASD). However, the grain size and the orientation of Cu pillar bumps changed significantly depending on the electroplating current density, and the undercut length also varied accordingly. The orientations and the grain sizes of Cu pillar bump was analyzed by EBSD and SEM, respectively. The grain orientation of the Cu filler bump was (111) at a current of 3.0 ASD, and the (100) and (110) orientations of the Cu filler bump were mainly formed at current conditions of 8.0 and 13.0 ASD. Also, the grain size of the Cu filler bump was 2.77 μm when the current density was 3.0 ASD, and 0.93 μm at current density of 13.0 ASD. Length of the undercut etched at the interface of Cu pillars and Cu pad of Si chip increased from 0.43 μm at 3.0 ASD to 1.72 μm at ASD 13.0. Thus, shear strength of Cu pillar bump decreased rapidly from 35.77 gf to 17.65 gf. This study is expected to contribute greatly to improving the reliability of next generation semiconductor packages by clarifying the correlation between electroplating conditions, orientation of grain in Cu pillar, and shear strength of Cu pillar bump. - Source: PubMed
Publication date: 2026/02/19
Yoon JaeJunShin TaekSooKim DongJinPark KunSangNa DongKeunGo YeonjuJung SeungBoo - The current work delves into the interactive effects of hard anodizing variables, including electrolyte concentration, temperature, current density, and time, on the microstructural, mechanical, and tribological characteristics of 6061 aluminum alloy. The results demonstrate that the final film characteristics are controlled by a kinetic balance between electrochemical oxide formation and chemical dissolution. The influence of electrolyte concentration and temperature was found to be non-monotonic, while a substantial synergistic effect between current density and time was observed. A maximum hardness of 679HV and a thickness of 59 μm was achieved using a sulfuric acid concentration of 190 g/L, an electrolyte temperature of -2 °C, a current density of 4.4 A/dm, and a duration of 60 min. These were considered the optimal anodizing conditions. Tribological examination confirmed the enhanced film's tribological behavior, exhibiting noticeably lower mass loss and a more stable coefficient of friction than the bare substrate. This enhancement is attributed to a shift in the wear mechanism from severe adhesive wear on the substrate to milder abrasion and, at high loads (50 N), brittle fracture on the hard anodic film. - Source: PubMed
Publication date: 2026/01/11
Behzadifar JavadNajafi YaserNazarizade Behzad