ADM2
- Known as:
- ADM2
- Catalog number:
- 001224A
- Product Quantity:
- 250ul
- Category:
- -
- Supplier:
- ABM
- Gene target:
- ADM2
Related genes to: ADM2
- Gene:
- ADM2 NIH gene
- Name:
- adrenomedullin 2
- Previous symbol:
- -
- Synonyms:
- AM2, FLJ21135
- Chromosome:
- 22q13.33
- Locus Type:
- gene with protein product
- Date approved:
- 2004-02-04
- Date modifiied:
- 2014-11-19
Related products to: ADM2
Related articles to: ADM2
- Because corrosive environments are created, agricultural equipment used in livestock farms and poultry houses that handle animal waste is vulnerable to corrosion. Therefore, the purpose of this work was to increase the corrosion resistance of AISI 1020 low-carbon steel by applying protective Ni@SiTiCNO nanocomposite coatings using the electrodeposition technique, where ‘@’ denotes the incorporation of nanoparticles into the matrix, not a core-shell structure. Fourier Transform Infrared Spectroscopy (FT-IR), Raman, Field Emission Scanning Electron Microscopy (FE-SEM, QUANTA EG) with an energy dispersive X-ray system (FE-SEM, EDS), and High-Resolution Transmission Electron Microscopy (HR-TEM) have all been used to study the structure and morphology of the SiTiCNO nanoparticle. Additionally, the surface area and optical characteristics were examined. During the deposition process, various SiTiCNO nanoparticle concentrations (0–2 g/L) and current densities (3–5 A/dm) were employed. The surface morphology, corrosion resistance (in urea 3.5%), and abrasion behavior have all been thoroughly examined. According to the corrosion resistance results, uncoated steel had a high corrosion rate (0.556 mm/a), whereas Ni@SiTiCNO deposited at 5/Adm from the Watts electrolyte bath containing 2 g/L SiTiCNO nanoparticle had the lower corrosion rate (0.008 mm/a) means the highest corrosion resistance. - Source: PubMed
Publication date: 2026/04/17
Nasr Gamal E MRefai Mohamed AElaziz Aliaa G AbdGomaa Mona HEl-Sheikh Said MAhmed Yasser M ZHamid Z Abdel - Collagen membranes are widely used biomaterials in periodontal and implant dentistry and can be combined with hyaluronic acid (HA). Although collagen membranes are expected to exhibit bioactive properties and support fibroblast infiltration, their specific impact on fibroblast behavior remains unclear. - Source: PubMed
Publication date: 2026/01/23
Panahipour LaylaHuang XiaoyuGruber Reinhard - The Cu pillar bump, an electrode formed on a silicon chip, connects the devices inside a high bandwidth memory (HBM) package and is the most important interconnection affecting the electrical, thermal, and mechanical properties of advanced semiconductor package. Recently, the number of input/output (I/O) in HBM packages has been increasing and the fine pitch of Cu pillar is also becoming significantly smaller. Therefore, the bonding strength between electrodes is deteriorating due to the increase in interconnection density and fine pitch, which threatens the reliability of semiconductor packages. Also, the bonding strengths between Cu pillars, electrodes inside HBM package are greatly affected by the plating process, package temperature, interconnection technology, package process, as well as thermal expansion coefficient of materials, crystal structure and orientation of the material, and electrochemical reaction while using electronic packages. After Ti is sputtered as a bonding layer and Cu is sputtered as a seed layer onto the Si chip electrode, and finally, Cu pillar bumps (25 μm in diameter, 55 μm in pitch) are formed through electroplating. When the Cu seed layer is removed by etching, leaving only the electrode portion of chip, the Cu pillar bump is completed, but an undercut occurs at the interface of Cu pillar and Cu seed layer during the etching process of Cu seed layer. Electroplating process of Cu pillar bump was performed at conditions of 3.0, 8.0 and 13.0 A/dm (ASD). However, the grain size and the orientation of Cu pillar bumps changed significantly depending on the electroplating current density, and the undercut length also varied accordingly. The orientations and the grain sizes of Cu pillar bump was analyzed by EBSD and SEM, respectively. The grain orientation of the Cu filler bump was (111) at a current of 3.0 ASD, and the (100) and (110) orientations of the Cu filler bump were mainly formed at current conditions of 8.0 and 13.0 ASD. Also, the grain size of the Cu filler bump was 2.77 μm when the current density was 3.0 ASD, and 0.93 μm at current density of 13.0 ASD. Length of the undercut etched at the interface of Cu pillars and Cu pad of Si chip increased from 0.43 μm at 3.0 ASD to 1.72 μm at ASD 13.0. Thus, shear strength of Cu pillar bump decreased rapidly from 35.77 gf to 17.65 gf. This study is expected to contribute greatly to improving the reliability of next generation semiconductor packages by clarifying the correlation between electroplating conditions, orientation of grain in Cu pillar, and shear strength of Cu pillar bump. - Source: PubMed
Publication date: 2026/02/19
Yoon JaeJunShin TaekSooKim DongJinPark KunSangNa DongKeunGo YeonjuJung SeungBoo - The current work delves into the interactive effects of hard anodizing variables, including electrolyte concentration, temperature, current density, and time, on the microstructural, mechanical, and tribological characteristics of 6061 aluminum alloy. The results demonstrate that the final film characteristics are controlled by a kinetic balance between electrochemical oxide formation and chemical dissolution. The influence of electrolyte concentration and temperature was found to be non-monotonic, while a substantial synergistic effect between current density and time was observed. A maximum hardness of 679HV and a thickness of 59 μm was achieved using a sulfuric acid concentration of 190 g/L, an electrolyte temperature of -2 °C, a current density of 4.4 A/dm, and a duration of 60 min. These were considered the optimal anodizing conditions. Tribological examination confirmed the enhanced film's tribological behavior, exhibiting noticeably lower mass loss and a more stable coefficient of friction than the bare substrate. This enhancement is attributed to a shift in the wear mechanism from severe adhesive wear on the substrate to milder abrasion and, at high loads (50 N), brittle fracture on the hard anodic film. - Source: PubMed
Publication date: 2026/01/11
Behzadifar JavadNajafi YaserNazarizade Behzad - Facing the issue of phosphorus (P) resource scarcity, microbial electrolysis cells (MECs) have garnered widespread attention from researchers due to their ability to recover P in the form of struvite without the need for external alkali addition. This study focuses on enhancing P recovery efficiency through modifying stainless steel mesh (SSM) cathodes with nickel-cobalt-tin (Ni-Co-Sn) composite materials and the circulation of catholyte in MECs. Results demonstrated that under optimal electrodeposition parameters (current density: 0.3 A/dm, duration: 1800 s, temperature: 50 °C, and Ni:Co:Sn molar ion ratio of 2:1:0.5), the Ni-Co-Sn-SSM cathode system significantly reduced the charge transfer resistance of the original SSM, achieved a solution pH of 8.85 within 12 h, and exhibited exceptional P recovery efficiency of 87.5 %. In cyclic operation mode with controlled conditions, the P recovery efficiency reached 96.4 % within 8 h and attained near-complete recovery (99.9 %) after 12 h. The Ni-Co-Sn-SSM cathode enhances P recovery by maximizing hydrogen adsorption and desorption, increasing OH generation, improving hydrogen evolution catalytic activity, and expanding the specific surface area to boost active sites and catholyte pH. Cathode modification and catholyte circulation significantly enhance P recovery, offering a sustainable solution for efficient P resource recycling. - Source: PubMed
Publication date: 2025/11/01
Lu XinyuPei WeiLiu XiangWang LintaoZhao HaoningLi Min